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Horizontal Grinding Machine: SGM-7000

The best choice for grinding base materials, Splintery.
Sapphire, GaN, GaAs, SiC and various compound semiconductor wafer up to 4”.
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Less damage back grinding than ever.
Available in ※ SGM-8000, 9000 up to 6” available.

Grinding
Lap/Polish
Lapping/Polishing Machine: SW-08/08P

New Mechanism ensures circumference flatness of work pieces.

Wafer Mount
Wafer DeM
Wafer Mounter: KBM-100

The Bonding Machine
Equipped with Double independent Air Cylinders.
Taking into account the Safety Aspect.

Wafer Demounter: SDK-300

State of the ART DeMounter for thinned Wafer
'Clack free' 'Chipping free' 'Scratch free' Advanced demount solution.
All for wafer.

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