Manual Wafer Mounter

Features

The POWATEC manual wafer mounter are the ideal solutions for the air-void-free mounting of commercially available tapes onto wafers and frames.

Model

P-200 & P-300

Specifications

Up to 4.5mm

Wafer Size

2” to 8” / 6” to 12”

Wafer Thickness

Frame Size (P-200)

6” (DT2-6-1) & 8” (DTF2-8-1)

Frame Size (P-300)

8” (DTF2-8-1) & 12” (DTF2-12, 2-12-1)

Film / Tape Width

150 - 300mm / 200 – 400mm

Clean Room Application

Up to ISO 4-5

Machine Dimension (P-200)

460mm(W) x 680mm(D) x 230mm(H)

Machine Dimension (P-300)

590mm(W) x 880mm(D) x 250mm(H)

Weight

~ 25KG / 33 KG

WaferMounter

Manual Wafer Laminator

Model

L-200 & L-300

Features

The Powatec L-200 and L-300 Manual Wafer Laminators are designed to laminate wafers, up to 300mm, with protective or back-grinding tapes/foils, the ideal solutions for air-void-free laminating of wafers.

Specifications

Wafer Size

2” to 8” / 6” to 12” (300mm)

Wafer Thickness

Up to 4.5mm

Film / Tape Width

150 - 300mm / 200 – 400mm

Clean Room Application

Up to ISO 4-5

Machine Dimension (L-200)

460mm(W) x 680mm(D) x 230mm(H)

Machine Dimension (L-300)

590mm(W) x 880mm(D) x 250mm(H)

Weight

~ 25KG / 33 KG

WaferLaminator

UV-LED Curing System

Model

Specifications

U-200 & U-300

Features

The POWATEC Curing systems are built to cure wafers mounted to frames up to 300 mm in diameter. By using LEDs instead of traditional means, there are numerous advantages that are gained including longer lifetime, lower maintenance costs, no warm-up time, and no ozone gas, etc.

Wafer Size (U-300)

Up to 300mm(w/frame) / Up to 400mm(w/o frame)

Wafer Size (U-200)

Up to 8”(w/frame) / Up to 300mm(w/o frame)

Frame Size (U-300)

Up to 300mm (DTF-2-12)

Frame Size (U-200)

Up to 8” (DTF2-8-1)

Wavelength

365nm +/-3nm

Max Substrate Thickness

5mm (Standard) / >5mm (possible with distance plates)

Dose

165-825mJ/cm2 / 145-1520 mJ/cm2

Radiant Flux Per LED

750mW

U-LEDCuringSys